Invention Grant
- Patent Title: Optical package structure
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Application No.: US17066412Application Date: 2020-10-08
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Publication No.: US11682684B2Publication Date: 2023-06-20
- Inventor: Cheng-Ling Huang , Lu-Ming Lai , Ying-Chung Chen
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
An optical package structure and a method for manufacturing an optical package structure are provided. The optical package structure includes a sensor, an optical component and a fixing element. The optical component directly contacts the sensor. An interfacial area is defined by a contacting region of the optical component and the sensor. The fixing element is disposed outside of the interfacial area for bonding the optical component and the sensor.
Public/Granted literature
- US20220115425A1 OPTICAL PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2022-04-14
Information query
IPC分类: