Invention Grant
- Patent Title: Structure of high-voltage transistor and method for fabricating the same
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Application No.: US17073038Application Date: 2020-10-16
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Publication No.: US11682728B2Publication Date: 2023-06-20
- Inventor: Chun-Ya Chiu , Chih-Kai Hsu , Chin-Hung Chen , Chia-Jung Hsu , Ssu-I Fu , Yu-Hsiang Lin
- Applicant: United Microelectronics Corp. , Chun-Ya Chiu , Chih-Kai Hsu , Chin-Hung Chen , Chia-Jung Hsu , Ssu-I Fu , Yu-Hsiang Lin
- Applicant Address: TW Hsinchu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Priority: CN 2010993261.3 2020.09.21
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/08 ; H01L29/165 ; H01L29/267 ; H01L29/66 ; H01L21/02

Abstract:
The disclosure discloses a structure of high-voltage (HV) transistor which includes a substrate. An epitaxial doped structure with a first conductive type is formed in the substrate, wherein a top portion of the epitaxial doped structure includes a top undoped epitaxial layer. A gate structure is disposed on the substrate and at least overlapping with the top undoped epitaxial layer. A source/drain (S/D) region with a second conductive type is formed in the epitaxial doped structure at a side of the gate structure. The first conductive type is different from the second conductive type.
Public/Granted literature
- US20220093798A1 STRUCTURE OF HIGH-VOLTAGE TRANSISTOR AND METHOD FOR FABRICATING THE SAME Public/Granted day:2022-03-24
Information query
IPC分类: