Invention Grant
- Patent Title: Methods of forming air spacers in semiconductor devices
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Application No.: US17576725Application Date: 2022-01-14
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Publication No.: US11682729B2Publication Date: 2023-06-20
- Inventor: Chao-Hsun Wang , Chen-Ming Lee , Kuo-Yi Chao , Mei-Yun Wang , Pei-Yu Chou , Kuo-Ju Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- The original application number of the division: US16572320 2019.09.16
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/02 ; H01L27/088 ; H01L29/417 ; H01L21/762 ; H01L21/764

Abstract:
A semiconductor structure includes a source/drain (S/D) feature disposed in a semiconductor layer, a metal gate stack (MG) disposed in a first interlayer dielectric (ILD) layer and adjacent to the S/D feature, a second ILD layer disposed over the MG, and an S/D contact disposed over the S/D feature. The semiconductor structure further includes an air gap disposed between a sidewall of a bottom portion of the S/D contact and the first ILD layer, where a sidewall of a top portion of the S/D contact is in direct contact with the second ILD layer.
Public/Granted literature
- US20220140142A1 Methods of Forming Air Spacers in Semiconductor Devices Public/Granted day:2022-05-05
Information query
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