Invention Grant
- Patent Title: Chip electronic component
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Application No.: US17137498Application Date: 2020-12-30
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Publication No.: US11688555B2Publication Date: 2023-06-27
- Inventor: Yukihiro Fujita , Shogo Kanbe , Kosuke Nakano , Hideki Otsuka
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP 16233717 2016.12.01
- Main IPC: H01G2/06
- IPC: H01G2/06 ; H01G4/232 ; H01G4/30 ; H01G4/12 ; H01G4/252

Abstract:
A chip electronic component includes spacers that each have a predetermined thickness direction dimension on a mounting surface in a direction perpendicular to the mounting surface. The spacers each contain, as a main component, an intermetallic compound containing at least one high-melting-point metal selected from Cu and Ni, and Sn defining a low-melting-point metal.
Public/Granted literature
- US20210118614A1 CHIP ELECTRONIC COMPONENT Public/Granted day:2021-04-22
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