- 专利标题: Mitigating thermal expansion mismatch in temperature probe construction apparatus and method
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申请号: US17243203申请日: 2021-04-28
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公开(公告)号: US11688614B2公开(公告)日: 2023-06-27
- 发明人: Farhat A. Quli , Razieh Mahzoon , Ran Liu
- 申请人: KLA Corporation
- 申请人地址: US CA Milpitas
- 专利权人: KLA Corporation
- 当前专利权人: KLA Corporation
- 当前专利权人地址: US CA Milpitas
- 代理机构: Suiter Swantz pc llo
- 主分类号: H01L21/67
- IPC分类号: H01L21/67 ; H01L21/66
摘要:
A process condition sensing apparatus is disclosed. The apparatus includes a substrate and an electronic enclosure including one or more electronic components. The apparatus includes a floating connection assembly configured to mechanically couple the electronic enclosure to the substrate, the floating connection assembly includes a leg and a foot. The leg or foot are arranged to mitigate thermal stress between one or more interfaces. The one or more interfaces include a leg-enclosure interface or a foot-substrate interface.
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