Invention Grant
- Patent Title: Semiconductor package
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Application No.: US17307672Application Date: 2021-05-04
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Publication No.: US11688707B2Publication Date: 2023-06-27
- Inventor: Joonho Jun , Sangsick Park , Unbyoung Kang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR 20200089860 2020.07.20
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/00

Abstract:
Provided is a semiconductor package including: a first substrate having a first electrode pad and a first protective layer in which a cavity is formed; a first bump pad arranged in the cavity and connected to the first electrode pad; a second substrate facing the first substrate and having a second bump pad; and a bump structure in contact with the first bump pad and the second bump pad, wherein the first electrode pad has a trapezoidal shape, and the first bump pad has a flat upper surface and an inclined side surface extending along a side surface of the first electrode pad.
Public/Granted literature
- US20220020713A1 SEMICONDUCTOR PACKAGE Public/Granted day:2022-01-20
Information query
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