Invention Grant
- Patent Title: Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frame
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Application No.: US17479988Application Date: 2021-09-20
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Publication No.: US11688715B2Publication Date: 2023-06-27
- Inventor: Rennier Rodriguez , Rammil Seguido , Raymond Albert Narvadez , Michael Tabiera
- Applicant: STMicroelectronics, Inc.
- Applicant Address: PH Calamba
- Assignee: STMicroelectronics, Inc.
- Current Assignee: STMicroelectronics, Inc.
- Current Assignee Address: PH Calamba
- Agency: Seed IP Law Group LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/495

Abstract:
The present disclosure is directed to a semiconductor die with multiple contact pads electrically coupled to a single lead via a single wire, and methods for fabricating the same. In one or more embodiments, multiple contact pads are electrically coupled to each other by a plurality of conductive layers stacked on top of each other. The uppermost conductive layer is then electrically coupled to a single lead via a single wire.
Public/Granted literature
- US20220005782A1 SEMICONDUCTOR DIE WITH MULTIPLE CONTACT PADS ELECTRICALLY COUPLED TO A LEAD OF A LEAD FRAME Public/Granted day:2022-01-06
Information query
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