公开(公告)号：US11152326B2

公开(公告)日：2021-10-19

申请号：US16664568

申请日：2019-10-25

Applicant: STMicroelectronics, Inc.

Inventor： Rennier Rodriguez ,  Rammil Seguido ,  Raymond Albert Narvadez ,  Michael Tabiera

IPC: H01L23/00 ,  H01L23/495

Abstract: The present disclosure is directed to a semiconductor die with multiple contact pads electrically coupled to a single lead via a single wire, and methods for fabricating the same. In one or more embodiments, multiple contact pads are electrically coupled to each other by a plurality of conductive layers stacked on top of each other. The uppermost conductive layer is then electrically coupled to a single lead via a single wire.

公开(公告)号：US20180190575A1

公开(公告)日：2018-07-05

申请号：US15399536

申请日：2017-01-05

Applicant: STMicroelectronics, Inc.

Inventor： Rennier Rodriguez ,  Raymond Albert Narvadez ,  Ernesto Antilano, JR.

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48 ,  H05K1/11

CPC classification number: H01L23/49555 ,  H01L21/4842 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83005 ,  H01L2224/85005 ,  H01L2924/1815 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The present disclosure is directed to a leadframe package having leads with protrusions on an underside of the leadframe. The protrusions come in various shapes and sizes. The protrusions extend from a body of encapsulant around the leadframe to couple to surface contacts on a substrate. The protrusions have a recess that is filled with encapsulant. Additionally, the protrusions may be part of the lead or may be a conductive layer on the lead. In some embodiments a die pad of the leadframe supporting a semiconductor die also has a protrusion on the underside of the leadframe. The protrusion on the die pad has a recess that houses an adhesive and at least part of the semiconductor die. The die pad with a protrusion may include anchor locks at the ends of the die pad to couple to the encapsulant.

公开(公告)号：US11688715B2

公开(公告)日：2023-06-27

申请号：US17479988

申请日：2021-09-20

Applicant: STMicroelectronics, Inc.

Inventor： Rennier Rodriguez ,  Rammil Seguido ,  Raymond Albert Narvadez ,  Michael Tabiera

IPC: H01L23/00 ,  H01L23/495

CPC classification number: H01L24/45 ,  H01L23/4952 ,  H01L23/49513 ,  H01L24/43

Abstract: The present disclosure is directed to a semiconductor die with multiple contact pads electrically coupled to a single lead via a single wire, and methods for fabricating the same. In one or more embodiments, multiple contact pads are electrically coupled to each other by a plurality of conductive layers stacked on top of each other. The uppermost conductive layer is then electrically coupled to a single lead via a single wire.

公开(公告)号：US10796984B2

公开(公告)日：2020-10-06

申请号：US16249612

申请日：2019-01-16

Applicant: STMicroelectronics, Inc.

Inventor： Rennier Rodriguez ,  Raymond Albert Narvadez ,  Ernesto Antilano, Jr.

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00

Abstract: The present disclosure is directed to a leadframe package having leads with protrusions on an underside of the leadframe. The protrusions come in various shapes and sizes. The protrusions extend from a body of encapsulant around the leadframe to couple to surface contacts on a substrate. The protrusions have a recess that is filled with encapsulant. Additionally, the protrusions may be part of the lead or may be a conductive layer on the lead. In some embodiments a die pad of the leadframe supporting a semiconductor die also has a protrusion on the underside of the leadframe. The protrusion on the die pad has a recess that houses an adhesive and at least part of the semiconductor die. The die pad with a protrusion may include anchor locks at the ends of the die pad to couple to the encapsulant.