Invention Grant
- Patent Title: Modular fingerprint recognition package having reduced size
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Application No.: US16650760Application Date: 2018-08-24
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Publication No.: US11688750B2Publication Date: 2023-06-27
- Inventor: Mi-Jin Kim , Seong-Jun Kim , Kyo-Ree Lee , Tae-Sang Park , Tack-Mo Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20170123573 2017.09.25
- International Application: PCT/KR2018/009804 2018.08.24
- International Announcement: WO2019/059543A 2019.03.28
- Date entered country: 2020-03-25
- Main IPC: H01L27/146
- IPC: H01L27/146 ; G06V10/147 ; G06V40/13
Abstract:
A fingerprint recognition package may include a circuit board; an image sensor die attached and electrically connected to the circuit board; a light-shielding member applied to the circuit board; and an adhesive member attached to one side of the light-shielding member. The light-shielding member can be cured by being irradiated with ultraviolet rays, and can be thermoset by being irradiated with heat.
Public/Granted literature
- US20200311376A1 FINGERPRINT RECOGNITION PACKAGE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2020-10-01
Information query
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