公开(公告)号：US10383235B2

公开(公告)日：2019-08-13

申请号：US14920513

申请日：2015-10-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-Je Bang ,  Mi-Jin Kim ,  Sae-Bom Lee ,  Hyun-Joo Han ,  Kun-Tak Kim

IPC: H05K3/32 ,  H01L23/552 ,  H01L23/00 ,  H05K1/02 ,  H05K3/34 ,  H01L23/36 ,  H01L23/10 ,  H01L21/56 ,  H01L23/373 ,  H01L23/42 ,  H01L23/427

Abstract: A method is provided for manufacturing a printed circuit board assembly. A method includes applying a liquefied radiant-heat material on a heating component mounted on the printed circuit board; mounting a shield unit on the printed circuit board in contact with the liquefied radiant-heat material; and simultaneously curing the liquefied radiant-heat material and bonding the shield unit.

公开(公告)号：US11688750B2

公开(公告)日：2023-06-27

申请号：US16650760

申请日：2018-08-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Mi-Jin Kim ,  Seong-Jun Kim ,  Kyo-Ree Lee ,  Tae-Sang Park ,  Tack-Mo Lee

IPC: H01L27/146 ,  G06V10/147 ,  G06V40/13

CPC classification number: H01L27/14618 ,  G06V10/147 ,  G06V40/1318 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14678 ,  H01L27/14685

Abstract: A fingerprint recognition package may include a circuit board; an image sensor die attached and electrically connected to the circuit board; a light-shielding member applied to the circuit board; and an adhesive member attached to one side of the light-shielding member. The light-shielding member can be cured by being irradiated with ultraviolet rays, and can be thermoset by being irradiated with heat.

公开(公告)号：US10426041B2

公开(公告)日：2019-09-24

申请号：US14920513

申请日：2015-10-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-Je Bang ,  Mi-Jin Kim ,  Sae-Bom Lee ,  Hyun-Joo Han ,  Kun-Tak Kim

IPC: H05K3/32 ,  H01L23/552 ,  H01L23/00 ,  H05K1/02 ,  H05K3/34 ,  H01L23/36 ,  H01L23/10 ,  H01L21/56 ,  H01L23/373 ,  H01L23/42 ,  H01L23/427

Abstract: A method is provided for manufacturing a printed circuit board assembly. A method includes applying a liquefied radiant-heat material on a heating component mounted on the printed circuit board; mounting a shield unit on the printed circuit board in contact with the liquefied radiant-heat material; and simultaneously curing the liquefied radiant-heat material and bonding the shield unit.

公开(公告)号：US20160120039A1

公开(公告)日：2016-04-28

申请号：US14920513

申请日：2015-10-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-Je BANG ,  Mi-Jin Kim ,  Sae-Bom Lee ,  Hyun-Joo Han ,  Kun-Tak Kim

IPC: H05K3/32 ,  H05K3/34

CPC classification number: H05K3/321 ,  H01L21/563 ,  H01L23/10 ,  H01L23/36 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/4275 ,  H01L23/552 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/29194 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/92125 ,  H01L2224/9221 ,  H01L2224/92225 ,  H01L2924/1421 ,  H01L2924/16152 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0203 ,  H05K1/0216 ,  H05K1/023 ,  H05K3/341 ,  H05K3/3494 ,  H05K2201/066 ,  H05K2201/10371 ,  H05K2201/1056 ,  Y02P70/613 ,  H01L2924/00

Abstract: A method is provided for manufacturing a printed circuit board assembly. A method includes applying a liquefied radiant-heat material on a heating component mounted on the printed circuit board; mounting a shield unit on the printed circuit board in contact with the liquefied radiant-heat material; and simultaneously curing the liquefied radiant-heat material and bonding the shield unit.

Abstract translation: 提供了制造印刷电路板组件的方法。 一种方法包括在安装在印刷电路板上的加热部件上施加液化辐射热材料; 将屏蔽单元安装在与液化辐射热材料接触的印刷电路板上; 同时固化液化的辐射热材料并粘合屏蔽单元。