公开(公告)号：US11688750B2

公开(公告)日：2023-06-27

申请号：US16650760

申请日：2018-08-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Mi-Jin Kim ,  Seong-Jun Kim ,  Kyo-Ree Lee ,  Tae-Sang Park ,  Tack-Mo Lee

IPC: H01L27/146 ,  G06V10/147 ,  G06V40/13

CPC classification number: H01L27/14618 ,  G06V10/147 ,  G06V40/1318 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14678 ,  H01L27/14685

Abstract: A fingerprint recognition package may include a circuit board; an image sensor die attached and electrically connected to the circuit board; a light-shielding member applied to the circuit board; and an adhesive member attached to one side of the light-shielding member. The light-shielding member can be cured by being irradiated with ultraviolet rays, and can be thermoset by being irradiated with heat.