Invention Grant
- Patent Title: Dual self-aligned gate endcap (SAGE) architectures
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Application No.: US17526986Application Date: 2021-11-15
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Publication No.: US11688792B2Publication Date: 2023-06-27
- Inventor: Sairam Subramanian , Walid M. Hafez , Sridhar Govindaraju , Mark Liu , Szuya S. Liao , Chia-Hong Jan , Nick Lindert , Christopher Kenyon
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/06 ; H01L27/088 ; H01L21/8234 ; H01L21/762 ; H01L21/768

Abstract:
Dual self-aligned gate endcap (SAGE) architectures, and methods of fabricating dual self-aligned gate endcap (SAGE) architectures, are described. In an example, an integrated circuit structure includes a first semiconductor fin having a cut along a length of the first semiconductor fin. A second semiconductor fin is parallel with the first semiconductor fin. A first gate endcap isolation structure is between the first semiconductor fin and the second semiconductor fin. A second gate endcap isolation structure is in a location of the cut along the length of the first semiconductor fin.
Public/Granted literature
- US20220077302A1 DUAL SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURES Public/Granted day:2022-03-10
Information query
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