Invention Grant
- Patent Title: Heatsinks for an image capture device
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Application No.: US17378992Application Date: 2021-07-19
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Publication No.: US11689790B2Publication Date: 2023-06-27
- Inventor: Nicholas Vitale , Raul Vargas Gonzalez , Herman Wong
- Applicant: GoPro, Inc.
- Applicant Address: US CA San Mateo
- Assignee: GoPro, Inc.
- Current Assignee: GoPro, Inc.
- Current Assignee Address: US CA San Mateo
- Agency: Young Basile Hanlon & MacFarlane, P.C.
- Main IPC: H04N5/232
- IPC: H04N5/232 ; H04N23/51 ; H05K1/02 ; G03B17/12 ; H05K1/18 ; G03B17/56 ; H04N23/54 ; H04N23/57

Abstract:
An image capture device that includes a housing and a heatsink located partially or completely within the housing. The heatsink comprises a planar surface, a printed circuit board in communication with the heatsink, and a sheet conductor that is a graphite sheet connected to the planar surface of the heatsink and in direct contact with the printed circuit board or components of the printed circuit board.
Public/Granted literature
- US20210344819A1 HEATSINKS FOR AN IMAGE CAPTURE DEVICE Public/Granted day:2021-11-04
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