公开(公告)号：US20230328345A1

公开(公告)日：2023-10-12

申请号：US18210817

申请日：2023-06-16

Applicant: GoPro, Inc.

Inventor： Nicholas Vitale ,  Raul Vargas Gonzalez ,  Herman Wong

IPC: H04N23/51 ,  H05K1/02 ,  G03B17/12 ,  H05K1/18 ,  G03B17/56 ,  H04N23/54 ,  H04N23/57

CPC classification number: H04N23/51 ,  H05K1/021 ,  G03B17/12 ,  H05K1/18 ,  G03B17/561 ,  H04N23/54 ,  H04N23/57

Abstract: An image capture device having a housing and a heatsink. The image capture device includes an integrated sensor and lens assembly. The heatsink is located partially or completely within the housing. The heatsink includes a through which a portion of the integrated sensor and lens assembly extends, and a planar surface located adjacent to the cutout. The planar surface includes a front side and a rear side. A printed circuit board in communication with a rear side of the planar surface of the heatsink. An LCD recess located in a front side of the planar surface of the heatsink that is configured to receive a liquid crystal display, wherein the LCD recess is opposite the printed circuit board.

公开(公告)号：US20240422413A1

公开(公告)日：2024-12-19

申请号：US18817995

申请日：2024-08-28

Applicant: GoPro, Inc.

Inventor： Nicholas Vitale ,  Raul Vargas Gonzalez ,  Paul Smith ,  Herman Wong ,  Akshay Shinde

IPC: H04N23/52 ,  H04N23/51

Abstract: An image capture device that includes a housing; a heat generating component enclosed by internal surfaces of the housing; and a first heatsink and a second heatsink that are each simultaneously and thermally connected with the heat generating component. One or both of the first and second heatsinks positioned on an external surface of the housing.

公开(公告)号：US20210344819A1

公开(公告)日：2021-11-04

申请号：US17378992

申请日：2021-07-19

Applicant: GoPro, Inc.

Inventor： Nicholas Vitale ,  Raul Vargas Gonzalez ,  Herman Wong

IPC: H04N5/225 ,  H05K1/18 ,  G03B17/12 ,  G03B17/56 ,  H05K1/02

Abstract: An image capture device that includes a housing and a heatsink located partially or completely within the housing. The heatsink comprises a planar surface, a printed circuit board in communication with the heatsink, and a sheet conductor that is a graphite sheet connected to the planar surface of the heatsink and in direct contact with the printed circuit board or components of the printed circuit board.

公开(公告)号：US20240272527A1

公开(公告)日：2024-08-15

申请号：US18169431

申请日：2023-02-15

Applicant: GoPro, Inc.

Inventor： Herman Wong ,  Nicholas Vitale

IPC: G03B17/56 ,  F16M11/04 ,  F16M11/10

CPC classification number: G03B17/566 ,  F16M11/041 ,  F16M11/10 ,  F16M2200/022

Abstract: An image capture device that includes a body and an interconnect mechanism that is connected to the body. The interconnect mechanism includes: a base plate defining a receptacle that is configured to threadably engage an accessory such that the image capture device is directly connectable to the accessory via the interconnect mechanism; a cover that is removably connected to the base plate and which is configured to thermally insulate the interconnect mechanism; and first and second fingers that are pivotably connected to the base plate about first and second pivot axes such that the interconnect mechanism is reconfigurable between a collapsed configuration, in which the first and second fingers are nested within the body of the image capture device, and an extended configuration, in which the first and second fingers extend outwardly from the body of the image capture device.

公开(公告)号：US11689790B2

公开(公告)日：2023-06-27

申请号：US17378992

申请日：2021-07-19

Applicant: GoPro, Inc.

Inventor： Nicholas Vitale ,  Raul Vargas Gonzalez ,  Herman Wong

IPC: H04N5/232 ,  H04N23/51 ,  H05K1/02 ,  G03B17/12 ,  H05K1/18 ,  G03B17/56 ,  H04N23/54 ,  H04N23/57

CPC classification number: H04N23/51 ,  G03B17/12 ,  G03B17/561 ,  H04N23/54 ,  H04N23/57 ,  H05K1/021 ,  H05K1/18

Abstract: An image capture device that includes a housing and a heatsink located partially or completely within the housing. The heatsink comprises a planar surface, a printed circuit board in communication with the heatsink, and a sheet conductor that is a graphite sheet connected to the planar surface of the heatsink and in direct contact with the printed circuit board or components of the printed circuit board.

公开(公告)号：US20210389646A1

公开(公告)日：2021-12-16

申请号：US17347543

申请日：2021-06-14

Applicant: GoPro, Inc.

Inventor： Chao Chen ,  Nicholas Vitale ,  Herman Wong ,  Adrian Santos

IPC: G03B17/14 ,  H04N5/225

Abstract: An image capture device includes a housing defining a receptacle having a housing electrical interface and a mechanical coupling mechanism coupled to or connected with the housing at a location of the receptacle. The image capture device includes an interchangeable lens module that releases connection with the mechanical coupling mechanism. The interchangeable lens module including a module electrical interface and an imaging sensor. A collar rotatable about the interchangeable lens module and lockable to the mechanical coupling mechanism to secure the interchangeable lens module to the housing and couple the module electrical interface to the housing electrical interface.