Invention Grant
- Patent Title: Electronic module housing for downhole use
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Application No.: US17017317Application Date: 2020-09-10
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Publication No.: US11692431B2Publication Date: 2023-07-04
- Inventor: Joachim Treviranus , Stephan Wink , Olaf Gaertner , Daniel Porzig , Tim Mueller , Andreas Peter
- Applicant: Baker Hughes Oilfield Operations LLC
- Applicant Address: US TX Houston
- Assignee: Baker Hughes Oilfield Operations LLC
- Current Assignee: Baker Hughes Oilfield Operations LLC
- Current Assignee Address: US TX Houston
- Agency: Hogan Lovells US LLP
- Main IPC: E21B47/017
- IPC: E21B47/017 ; E21B47/013 ; E21B49/00 ; E21B49/08

Abstract:
Methods, systems, devices, and products for downhole operations. Embodiments include downhole tools comprising an outer member configured for conveyance in the borehole; a pressure barrel positioned inside the outer member; a substantially cylindrical pod positioned inside the pressure barrel; and at least one downhole electronic component mounted between the exterior surface and the frame. The pod comprises at least one rigid outer surface forming an exterior surface of the pod and supported by a central frame extending across a diameter of the pod, such as a plurality of outer rigid surfaces. The pod may include a plurality of coupled rigid elongated semicircular metallic shells, wherein each shell of the plurality comprises a rigid outer surface of the plurality of outer rigid surfaces. Each of the at least one downhole electronic component may be sealingly enclosed within a corresponding shell.
Public/Granted literature
- US1237034A Tag-seal. Public/Granted day:1917-08-14
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