Invention Grant
- Patent Title: Multi-die power management in SoCs
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Application No.: US17676668Application Date: 2022-02-21
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Publication No.: US11693472B2Publication Date: 2023-07-04
- Inventor: Ilya Granovsky , Doron Rajwan , Tal Kuzi , Nir Leshem , Lior Zimet
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kowert, Hood, Munyon, Rankin & Goetzel, P.C.
- Agent Gareth M. Sampson
- Main IPC: G06F1/32
- IPC: G06F1/32 ; G06F1/324 ; G06F1/3206

Abstract:
Various techniques and circuit implementations for power reduction management in integrated circuits are disclosed. Certain techniques include the implementation of rate control circuits to control a clock rate for circuits associated with a communication fabric in an integrated circuit. The clock rate may be reduced based trigger signals received from power delivery trigger circuits coupled to the integrated circuit and voltage regulators providing power to the integrated circuit. Additional techniques may include the use of rate limiter circuits in a memory pipeline.
Public/Granted literature
- US20230063331A1 Multi-Die Power Management in SoCs Public/Granted day:2023-03-02
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