- 专利标题: Chip and associated chip system
-
申请号: US17340062申请日: 2021-06-06
-
公开(公告)号: US11694743B2公开(公告)日: 2023-07-04
- 发明人: Ching-Sheng Cheng
- 申请人: Realtek Semiconductor Corp.
- 申请人地址: TW HsinChu
- 专利权人: Realtek Semiconductor Corp.
- 当前专利权人: Realtek Semiconductor Corp.
- 当前专利权人地址: TW HsinChu
- 代理商 Winston Hsu
- 优先权: TW 9130067 2020.09.02
- 主分类号: G11C16/04
- IPC分类号: G11C16/04 ; G11C11/408 ; G06F13/42
摘要:
A chip system includes a first chip, a first DRAM, a second chip and a second DRAM. The first chip includes a first DRAM controller and a first serial transmission interface. The first DRAM is coupled to the first DRAM controller. The second chip includes a second DTAM controller and a second serial transmission interface. The second serial transmission interface is coupled to the first serial transmission interface. The second DRAM is coupled to the second DRAM controller. When the first chip intends to store first data and second data, the first chip stores the first data into the first DRAM via the first DRAM controller, and transmits the second data to the second chip via the first serial transmission interface; and the second chip stores the second data into the second DRAM via the second DRAM controller.
公开/授权文献
- US20220068344A1 CHIP AND ASSOCIATED CHIP SYSTEM 公开/授权日:2022-03-03
信息查询