- 专利标题: Sleeve soldering device and method of producing electronic device
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申请号: US16874711申请日: 2020-05-15
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公开(公告)号: US11696411B2公开(公告)日: 2023-07-04
- 发明人: Hayato Kiuchi , Atsushi Furumoto , Kazuyuki Hamamoto , Teruhiko Iwase , Masayuki Fujihira
- 申请人: DENSO CORPORATION
- 申请人地址: JP Kariya
- 专利权人: DENSO CORPORATION
- 当前专利权人: DENSO CORPORATION
- 当前专利权人地址: JP Kariya
- 代理机构: Harness, Dickey & Pierce, P.L.C.
- 优先权: JP 2019093025 2019.05.16
- 主分类号: B23K3/00
- IPC分类号: B23K3/00 ; H05K3/34 ; B23K1/00 ; B23K3/047 ; B23K3/03 ; G05D23/24 ; B23K101/42
摘要:
A sleeve soldering device has a displacement sensor and a heat flux sensor. The displacement sensor detects a physical quantity related to a pressure from a heated sleeve heated by a heater onto an electric board when the heated sleeve presses the electric board. The displacement sensor detects a physical quantity related to a deformation amount of the electric board due to thermal energy from the heater. The heat flux sensor detects a physical quantity related to a heat transfer amount from the heater to the electric board when the heated sleeve is pressed to the electric board. A control part compares each of detection values obtained from the displacement sensor and the heat flux sensor with a respective judgment reference so as to detect whether each detection value satisfies the respective reference.
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