Invention Grant
- Patent Title: Memory arrays and methods used in forming a memory array comprising strings of memory cells
-
Application No.: US17524913Application Date: 2021-11-12
-
Publication No.: US11700729B2Publication Date: 2023-07-11
- Inventor: Yi Hu , Ramey M. Abdelrahaman , Narula Bilik , Daniel Billingsley , Zhenyu Bo , Joan M. Kash , Matthew J. King , Andrew Li , David Neumeyer , Wei Yeeng Ng , Yung K. Pak , Chandra Tiwari , Yiping Wang , Lance Williamson , Xiaosong Zhang
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Weils St. John P.S.
- The original application number of the division: US16550238 2019.08.25
- Main IPC: H10B41/27
- IPC: H10B41/27 ; H10B41/35 ; H10B43/27 ; H10B43/35

Abstract:
A memory array comprising strings of memory cells comprises laterally-spaced memory blocks individually comprising a vertical stack comprising alternating insulative tiers and conductive tiers. Operative channel-material strings of memory cells extend through the insulative tiers and the conductive tiers. Intervening material is laterally-between and longitudinally-along immediately-laterally-adjacent of the memory blocks. The intervening material comprises longitudinally-alternating first and second regions that individually have a vertically-elongated seam therein. The vertically-elongated seam in the first regions are taller than in the second regions. Additional embodiments, including method, are disclosed.
Public/Granted literature
- US20220077169A1 Memory Arrays And Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells Public/Granted day:2022-03-10
Information query