- 专利标题： Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same
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申请号： US16767808申请日： 2019-01-09
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公开(公告)号： US11702520B2公开(公告)日： 2023-07-18
- 发明人: Minsu Jeong , You Jin Kyung , Byung Ju Choi , Woo Jae Jeong , Kwang Joo Lee , Eunbyurl Cho
- 申请人： LG CHEM, LTD.
- 申请人地址： KR Seoul
- 专利权人： LG CHEM, LTD.
- 当前专利权人： LG CHEM, LTD.
- 当前专利权人地址： KR Seoul
- 代理机构： Rothwell, Figg, Ernst & Manbeck, P.C.
- 优先权： KR 20180004041 2018.01.11 KR 20190001976 2019.01.07
- 国际申请： PCT/KR2019/000353 2019.01.09
- 国际公布： WO2019/139354A 2019.07.18
- 进入国家日期： 2020-05-28
- 主分类号： C08J5/18
- IPC分类号： C08J5/18 ; C08G59/14 ; C08K3/36 ; H01L23/29
摘要：
The present invention relates to an epoxy resin composition for molding a semiconductor having excellent heat resistance and mechanical properties and also having improved visibility while having a low coefficient of thermal expansion and thus exhibiting improved warpage characteristics, and a molding film and a semiconductor package using such an epoxy resin composition for molding a semiconductor.
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