Invention Grant
- Patent Title: Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same
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Application No.: US16767808Application Date: 2019-01-09
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Publication No.: US11702520B2Publication Date: 2023-07-18
- Inventor: Minsu Jeong , You Jin Kyung , Byung Ju Choi , Woo Jae Jeong , Kwang Joo Lee , Eunbyurl Cho
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG CHEM, LTD.
- Current Assignee: LG CHEM, LTD.
- Current Assignee Address: KR Seoul
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: KR 20180004041 2018.01.11 KR 20190001976 2019.01.07
- International Application: PCT/KR2019/000353 2019.01.09
- International Announcement: WO2019/139354A 2019.07.18
- Date entered country: 2020-05-28
- Main IPC: C08J5/18
- IPC: C08J5/18 ; C08G59/14 ; C08K3/36 ; H01L23/29
Abstract:
The present invention relates to an epoxy resin composition for molding a semiconductor having excellent heat resistance and mechanical properties and also having improved visibility while having a low coefficient of thermal expansion and thus exhibiting improved warpage characteristics, and a molding film and a semiconductor package using such an epoxy resin composition for molding a semiconductor.
Public/Granted literature
- US20200347194A1 EPOXY RESIN COMPOSITION FOR MOLDING SEMICONDUCTOR, MOLDING FILM AND SEMICONDUCTOR PACKAGE USING THE SAME Public/Granted day:2020-11-05
Information query
