Invention Grant
- Patent Title: Method of manufacturing and modularizing assembled thermal management material based on diamond-graphene hybrid structure
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Application No.: US17155992Application Date: 2021-01-22
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Publication No.: US11702736B2Publication Date: 2023-07-18
- Inventor: Jae Kap Lee , Hyunsu Ju
- Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
- Applicant Address: KR Seoul
- Assignee: Korea Institute of Science and Technology
- Current Assignee: Korea Institute of Science and Technology
- Current Assignee Address: KR Seoul
- Agency: Rabin & Berdo, P.C.
- Priority: KR 20200013828 2020.02.05
- Main IPC: C23C16/27
- IPC: C23C16/27 ; H01L23/373

Abstract:
Provided are a method of manufacturing a diamond-graphene hybrid heat spreader-thermal interface material assembled thermal management material including: (a) preparing a planar diamond base material; and (b) converting a predetermined thickness of at least a partial area of one side or both sides of the diamond base material into vertical graphene, wherein the diamond base material serves as a heat spreader, and a graphene layer formed on the diamond base material serves as a thermal interface material (TIM) or a heat sink, and a method of modulating the diamond-graphene hybrid thermal management material including modulating the thermal management material by attaching a heterogenous member to the surface of the diamond-graphene hybrid thermal management material and pressurizing the attached structure.
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