Method of manufacturing and modularizing assembled thermal management material based on diamond-graphene hybrid structure

    公开(公告)号:US11702736B2

    公开(公告)日:2023-07-18

    申请号:US17155992

    申请日:2021-01-22

    CPC classification number: C23C16/27 H01L23/3732 H01L23/3737

    Abstract: Provided are a method of manufacturing a diamond-graphene hybrid heat spreader-thermal interface material assembled thermal management material including: (a) preparing a planar diamond base material; and (b) converting a predetermined thickness of at least a partial area of one side or both sides of the diamond base material into vertical graphene, wherein the diamond base material serves as a heat spreader, and a graphene layer formed on the diamond base material serves as a thermal interface material (TIM) or a heat sink, and a method of modulating the diamond-graphene hybrid thermal management material including modulating the thermal management material by attaching a heterogenous member to the surface of the diamond-graphene hybrid thermal management material and pressurizing the attached structure.

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