Invention Grant
- Patent Title: Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane
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Application No.: US17503690Application Date: 2021-10-18
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Publication No.: US11706870B2Publication Date: 2023-07-18
- Inventor: Joel Goergen , Jessica Kiefer , Alpesh Umakant Bhobe , Kameron Rose Hurst , D. Brice Achkir , Amendra Koul , Scott Hinaga , David Nozadze
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: CISCO TECHNOLOGY, INC.
- Current Assignee: CISCO TECHNOLOGY, INC.
- Current Assignee Address: US CA San Jose
- Agency: Edell, Shapiro & Finnan, LLC
- Main IPC: H05K3/46
- IPC: H05K3/46 ; H05K1/09
Abstract:
A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.
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