Invention Grant
- Patent Title: Integrated photonic device with improved optical coupling
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Application No.: US17540626Application Date: 2021-12-02
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Publication No.: US11709315B2Publication Date: 2023-07-25
- Inventor: Frederic Boeuf , Charles Baudot
- Applicant: STMicroelectronics (Crolles 2) SAS
- Applicant Address: FR Crolles
- Assignee: STMicroelectronics (Crolles 2) SAS
- Current Assignee: STMicroelectronics (Crolles 2) SAS
- Current Assignee Address: FR Crolles
- Agency: Crowe & Dunlevy
- Priority: FR 54523 2016.05.20
- The original application number of the division: US16847189 2020.04.13
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/30 ; G02B6/124 ; G02B6/122 ; G02B6/126 ; G02B6/27 ; G02B6/34 ; G02B6/42

Abstract:
A three-dimensional photonic integrated structure includes a first semiconductor substrate and a second semiconductor substrate. The first substrate incorporates a first waveguide and the second semiconductor substrate incorporates a second waveguide. An intermediate region located between the two substrates is formed by a one dielectric layer. The second substrate further includes an optical coupler configured for receiving a light signal. The first substrate and dielectric layer form a reflective element located below and opposite the grating coupler in order to reflect at least one part of the light signal.
Public/Granted literature
- US20220091330A1 INTEGRATED PHOTONIC DEVICE WITH IMPROVED OPTICAL COUPLING Public/Granted day:2022-03-24
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