Invention Grant
- Patent Title: Semiconductor memory device and method for fabricating thereof
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Application No.: US17227793Application Date: 2021-04-12
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Publication No.: US11711918B2Publication Date: 2023-07-25
- Inventor: Kyung Hwan Lee , Yong Seok Kim , Hyun Cheol Kim , Satoru Yamada , Sung Won Yoo , Jae Ho Hong
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR 20200051154 2020.04.28
- Main IPC: H10B41/70
- IPC: H10B41/70 ; H10B41/20 ; H10B41/35 ; H10B41/41 ; H10B41/50

Abstract:
Provided is a semiconductor memory device. The semiconductor memory device comprises a first semiconductor pattern including a first impurity region, a second impurity region, and a channel region, the first impurity region spaced apart from a substrate in a first direction and having a first conductivity type, the second impurity region having a second conductivity type different from the first conductivity type, and the channel region between the first impurity region and the second impurity region, a first conductive connection line connected to the first impurity region and extending in a second direction different from the first direction and a first gate structure extending in the first direction and including a first gate electrode and a first gate insulating film, wherein the first gate electrode penetrates the channel region and the first gate insulating film is between the first gate electrode and the semiconductor pattern.
Public/Granted literature
- US20210335798A1 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRICATING THEREOF Public/Granted day:2021-10-28
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