A disassembling device facilitating a gentle disassembly of components glued together includes a base, a heating plate, a moving member, and a vacuum suction assembly. The disassembling device disassembles and separates portions of an electronic device for post-manufacture analysis or other purposes. The electronic device can disassemble glued parts with speed and high efficiency. By applying suction and sufficient heating to glued-together portions of the electronic device, damages to the electronic device can be avoided.