- 专利标题： Methods for partial gold plating of metal packaging housings and packaging housings thereof
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申请号： US18048510申请日： 2022-10-21
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公开(公告)号： US11725294B2公开(公告)日： 2023-08-15
- 发明人: Xiao Ma , Lei Yang , Huasan Chen , Zhengsheng Tang , Jin Sun , Bo Zhou , Minglong Wang
- 申请人： HEFEI SHENGDA ELECTRONICS TECHNOLOGY INDUSTRY CO., LTD.
- 申请人地址： CN Hefei
- 专利权人： HEFEI SHENGDA ELECTRONICS TECHNOLOGY INDUSTRY CO., LTD
- 当前专利权人： HEFEI SHENGDA ELECTRONICS TECHNOLOGY INDUSTRY CO., LTD
- 当前专利权人地址： CN Hefei
- 代理机构： Metis IP LLC
- 优先权： CN 2111492633.5 2021.12.08
- 主分类号： C25D3/14
- IPC分类号： C25D3/14 ; C25D3/48 ; C25D5/34 ; C25D13/18 ; C25D5/12 ; C25D5/02
摘要：
The present disclosure involves a method for partial gold plating of a metal packaging housing and a packaging housing thereof. The packaging housing may include a base. The base may be provided with at least one lead hole. A housing lead may be interspersed in the lead hole. The lead hole may be also provided with an insulator surrounding the housing lead. The method may include operations such as nickel plating, oxidation, gold plating, reduction, etc.
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