专利检索 ap:("HEFEI SHENGDA ELECTRONICS TECHNOLOGY INDUSTRY CO., LTD.") AND inv:"Huasan Chen" 第 1 页

1.

发明授权
Methods for partial gold plating of metal packaging housings and packaging housings thereof 有权

公开(公告)号：US11725294B2

公开(公告)日：2023-08-15

申请号：US18048510

申请日：2022-10-21

申请人： HEFEI SHENGDA ELECTRONICS TECHNOLOGY INDUSTRY CO., LTD.

发明人： Xiao Ma , Lei Yang , Huasan Chen , Zhengsheng Tang , Jin Sun , Bo Zhou , Minglong Wang

IPC分类号： C25D3/14 , C25D3/48 , C25D5/34 , C25D13/18 , C25D5/12 , C25D5/02

CPC分类号： C25D3/14 , C25D3/48 , C25D5/02 , C25D5/12 , C25D5/34 , C25D13/18

摘要： The present disclosure involves a method for partial gold plating of a metal packaging housing and a packaging housing thereof. The packaging housing may include a base. The base may be provided with at least one lead hole. A housing lead may be interspersed in the lead hole. The lead hole may be also provided with an insulator surrounding the housing lead. The method may include operations such as nickel plating, oxidation, gold plating, reduction, etc.