Invention Grant
- Patent Title: Method of forming patterns, integrated circuit device, and method of manufacturing the integrated circuit device
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Application No.: US17680996Application Date: 2022-02-25
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Publication No.: US11728167B2Publication Date: 2023-08-15
- Inventor: Dongjun Lee , Keunnam Kim , Daehyoun Kim , Taejin Park , Sunghee Han
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR 20190076683 2019.06.26
- Main IPC: H01L21/033
- IPC: H01L21/033 ; H01L21/027 ; H01L21/768 ; H01L21/311

Abstract:
A hardmask structure including a plurality of hardmask layers is formed on a target layer in a first area and a second area, a first photoresist pattern in the first area and a second photoresist pattern in the second area are formed, a reversible hardmask pattern including a plurality of openings is formed by transferring shapes of the first and second photoresist patterns to a reversible hardmask layer that is one of the plurality of hardmask layers, a gap-fill hardmask pattern is formed by filling some of the plurality of openings formed in the first area with a gap-fill hardmask pattern material, and a feature pattern is formed in the target layer by transferring a shape of the gap-fill hardmask pattern to the target layer in the first area and a shape of the reversible hardmask pattern to the target layer in the second area.
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Information query
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