Invention Grant
- Patent Title: Localized stressor formation by ion implantation
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Application No.: US17032419Application Date: 2020-09-25
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Publication No.: US11728383B2Publication Date: 2023-08-15
- Inventor: Sipeng Gu , Wei Zou , Kyu-Ha Shim , Qintao Zhang
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Nields, Lemack & Frame, LLC
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L29/76 ; H01L21/265

Abstract:
A P-type field effect transistor (PFET) device and a method for fabricating a PFET device using fully depleted silicon on insulator (FDSOI) technology is disclosed. The method includes introducing germanium into the channel layer using ion implantation. This germanium implant increases the axial stress in the channel layer, improving device performance. This implant may be performed at low temperatures to minimize damage to the crystalline structure. Further, rather than using a long duration, high temperature anneal process, the germanium implanted in the channel layer may be annealed using a laser anneal or a rapid temperature anneal. The implanted regions are re-crystallized using the channel layer that is beneath the gate as the seed layer. In some embodiments, an additional oxide spacer is used to further separate the raised source and drain regions from the gate.
Public/Granted literature
- US20220102500A1 Localized Stressor Formation By Ion Implantation Public/Granted day:2022-03-31
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