Invention Grant
- Patent Title: Treatment system and method
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Application No.: US16901967Application Date: 2020-06-15
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Publication No.: US11732379B2Publication Date: 2023-08-22
- Inventor: Zong-Kun Lin , Hsuan-Chih Chu , Chien-Hsun Pan , Yen-Yu Chen , Yi-Ming Dai
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Seed Intellectual Property Law Group LLP
- Main IPC: B01D61/18
- IPC: B01D61/18 ; B01D63/16 ; C25D21/06

Abstract:
The treatment system provides a feature that may reduce cost of the electrochemical plating process by reusing the virgin makeup solution in the spent electrochemical plating bath. The treatment system provides a rotating filter shaft which receives the spent electrochemical plating bath and captures the additives and by-products created by the additives during the electrochemical plating process. To capture the additives and the by-products, the rotating filter shaft includes one or more types of membranes. Materials such as semi-permeable membrane are used to capture the used additives and by-products in the spent electrochemical plating bath. The treatment system may be equipped with an electrochemical sensor to monitor a level of additives in the filtered electrochemical plating bath.
Public/Granted literature
- US20210388524A1 TREATMENT SYSTEM AND METHOD Public/Granted day:2021-12-16
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