公开(公告)号：US11732379B2

公开(公告)日：2023-08-22

申请号：US16901967

申请日：2020-06-15

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Zong-Kun Lin ,  Hsuan-Chih Chu ,  Chien-Hsun Pan ,  Yen-Yu Chen ,  Yi-Ming Dai

IPC: B01D61/18 ,  B01D63/16 ,  C25D21/06

CPC classification number: C25D21/06 ,  B01D61/18 ,  B01D63/16 ,  B01D2311/2642 ,  B01D2313/18 ,  B01D2313/22 ,  B01D2313/44

Abstract: The treatment system provides a feature that may reduce cost of the electrochemical plating process by reusing the virgin makeup solution in the spent electrochemical plating bath. The treatment system provides a rotating filter shaft which receives the spent electrochemical plating bath and captures the additives and by-products created by the additives during the electrochemical plating process. To capture the additives and the by-products, the rotating filter shaft includes one or more types of membranes. Materials such as semi-permeable membrane are used to capture the used additives and by-products in the spent electrochemical plating bath. The treatment system may be equipped with an electrochemical sensor to monitor a level of additives in the filtered electrochemical plating bath.

公开(公告)号：US20210071295A1

公开(公告)日：2021-03-11

申请号：US17101586

申请日：2020-11-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsuan-Chih Chu ,  Chien-Hsun Pan ,  Yen-Yu Chen ,  Chun-Chih Lin

IPC: C23C14/54 ,  H01L21/285 ,  C23C14/35 ,  C23C14/34 ,  H01L21/67 ,  H01J37/34

Abstract: Sputtering systems and methods are provided. In an embodiment, a sputtering system includes a chamber configured to receive a substrate, a sputtering target positioned within the chamber, and an electromagnet array over the sputtering target. The electromagnet array includes a plurality of electromagnets.

公开(公告)号：US12104268B2

公开(公告)日：2024-10-01

申请号：US18340299

申请日：2023-06-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Zong-Kun Lin ,  Hsuan-Chih Chu ,  Chien-Hsun Pan ,  Yen-Yu Chen ,  Yi-Ming Dai

IPC: C25D21/06 ,  B01D61/18 ,  B01D63/16

CPC classification number: C25D21/06 ,  B01D61/18 ,  B01D63/16 ,  B01D2311/2642 ,  B01D2313/18 ,  B01D2313/44

Abstract: The treatment system provides a feature that may reduce cost of the electrochemical plating process by reusing the virgin makeup solution in the spent electrochemical plating bath. The treatment system provides a rotating filter shaft which receives the spent electrochemical plating bath and captures the additives and by-products created by the additives during the electrochemical plating process. To capture the additives and the by-products, the rotating filter shaft includes one or more types of membranes. Materials such as semi-permeable membrane are used to capture the used additives and by-products in the spent electrochemical plating bath. The treatment system may be equipped with an electrochemical sensor to monitor a level of additives in the filtered electrochemical plating bath.

公开(公告)号：US10345254B2

公开(公告)日：2019-07-09

申请号：US15689195

申请日：2017-08-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yung-Chang Huang ,  Jui-Mu Cho ,  Chien-Hsun Pan ,  Chun-Chih Lin

IPC: G01N27/26 ,  C25D13/18 ,  C25D13/02 ,  G01N27/416 ,  C25D21/14 ,  C25D21/18 ,  H01L21/66 ,  C25B11/04 ,  C25D3/38

Abstract: Detection methods for an electroplating process are provided. A detection method includes immersing a substrate into an electrolyte solution to perform an electroplating process. The electrolyte solution includes an additive agent. The detection method also includes immersing a detection device into the electrolyte solution. The detection method further includes applying a first alternating current (AC) voltage or direct current (DC) voltage to the detection device to detect the concentration of the additive agent. In addition, the detection method includes applying a combination of a second AC voltage and a second DC voltage to the detection device to inspect the electrolyte solution. An impurity is detected in the electrolyte solution. The detection method also includes replacing the electrolyte solution containing the impurity with another electrolyte solution.

公开(公告)号：US20190136369A1

公开(公告)日：2019-05-09

申请号：US15806729

申请日：2017-11-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsuan-Chih Chu ,  Chien-Hsun Pan ,  Yen-Yu Chen ,  Chun-Chih Lin

IPC: C23C14/54 ,  H01L21/285 ,  H01L21/67 ,  C23C14/34 ,  C23C14/35

Abstract: Sputtering systems and methods are provided. In an embodiment, a sputtering system includes a chamber configured to receive a substrate, a sputtering target positioned within the chamber, and an electromagnet array over the sputtering target. The electromagnet array includes a plurality of electromagnets.