Invention Grant
- Patent Title: Semiconductor structure and method for forming the same
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Application No.: US17225437Application Date: 2021-04-08
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Publication No.: US11735471B2Publication Date: 2023-08-22
- Inventor: Chia-Ta Yu , Kai-Hsuan Lee , Sai-Hooi Yeong , Yen-Chieh Huang , Feng-Cheng Yang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L29/78 ; H01L29/08 ; H01L29/45 ; H01L23/532 ; H01L29/66 ; H01L21/285 ; H01L23/535

Abstract:
A semiconductor structure includes a fin structure formed over a substrate. The structure also includes a gate structure formed across the fin structure. The structure also includes source/drain epitaxial structures formed on opposite sides of the gate structure. The structure also includes an inter-layer dielectric (ILD) structure formed over the gate structure. The structure also includes a contact blocking structure formed through the ILD structure over the source/drain epitaxial structure. A lower portion of the contact blocking structure is surrounded by an air gap, and the air gap is covered by a portion of the ILD structure.
Public/Granted literature
- US20220328344A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2022-10-13
Information query
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