Invention Grant
- Patent Title: Multi-core broadband PCB antenna
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Application No.: US16871822Application Date: 2020-05-11
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Publication No.: US11735804B2Publication Date: 2023-08-22
- Inventor: Chaoqi Zhang , Suhyung Hwang , Jaehyun Yeon , Taesik Yang , Jeongil Jay Kim , Darryl Sheldon Jessie , Mohammad Ali Tassoudji
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM INCORPORATED
- Current Assignee: QUALCOMM INCORPORATED
- Current Assignee Address: US CA San Diego
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01Q1/38
- IPC: H01Q1/38 ; H01Q1/12 ; H05K1/02 ; H05K3/00 ; H05K3/46

Abstract:
A multi-core broadband printed circuit board (PCB) antenna and methods for fabricating such an antenna are provided. One example antenna implemented with a multi-core PCB generally includes a first core structure, a second core structure disposed above the first core structure, and one or more metal layers disposed above the second core structure or below the first core structure. The first core structure includes a first core layer, a first metal layer disposed below the first core layer, and a second metal layer disposed above the first core layer. The second core structure includes a second core layer, a third metal layer disposed below the second core layer, and a fourth metal layer disposed above the second core layer. The first core layer and the second core layer may have different thicknesses.
Public/Granted literature
- US20210351488A1 MULTI-CORE BROADBAND PCB ANTENNA Public/Granted day:2021-11-11
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