Invention Grant
- Patent Title: Ultra-high bandwidth inductorless amplifier
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Application No.: US17173947Application Date: 2021-02-11
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Publication No.: US11736069B2Publication Date: 2023-08-22
- Inventor: Hao Liu , Li Sun , Dong Ren
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM INCORPORATED
- Current Assignee: QUALCOMM INCORPORATED
- Current Assignee Address: US CA San Diego
- Agency: Loza & Loza, LLP
- Main IPC: H03F3/45
- IPC: H03F3/45 ; H03F1/34 ; H03F1/26

Abstract:
An amplifier has a first amplifying circuit configured to receive a voltage input and to output an amplified current, a second amplifying circuit configured to receive the amplified current and to output an amplified voltage, the second amplifying circuit comprising a pair of feedback resistive elements, each feedback resistive element being coupled to a gate and drain of a corresponding transistor in a pair of output transistors in the second amplifying circuit, and a feedback circuit configured to provide a negative feedback loop between an input and an output of the pair of output transistors, the feedback circuit including a first transconductance amplification circuit and a first equalizing circuit.
Public/Granted literature
- US20220255509A1 ULTRA-HIGH BANDWIDTH INDUCTORLESS AMPLIFIER Public/Granted day:2022-08-11
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