Invention Grant
- Patent Title: Electrically conductive multilayer film and gasket
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Application No.: US17606697Application Date: 2019-05-13
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Publication No.: US11744055B2Publication Date: 2023-08-29
- Inventor: Bing Huang , Su Zhang , Xin Zhang , Jing Fang , Fan Gao
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN St. Paul
- Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee Address: US MN St. Paul
- Agent Clifton F. Richardson
- International Application: PCT/CN2019/086590 2019.05.13
- International Announcement: WO2020/227881A 2020.11.19
- Date entered country: 2021-10-26
- Main IPC: H05K9/00
- IPC: H05K9/00

Abstract:
An electrically conductive multilayer film for providing an electrical path between two conductive surfaces includes a plastic backing layer, an electrically conductive layer disposed on a first side of the plastic backing layer, and a recovery layer disposed on an opposite second side of the plastic backing layer. An average thickness of the multilayer film is less than about 100 microns. A hollow gasket can be formed from the multilayer film by winding or bending the multilayer film into a flexible hollow closed loop. When the multilayer film is wound to form a flexible closed loop having an outside diameter of no more than about 7 mm with the conductive layer forming an outside layer of the loop, a resistance of the closed loop across a diameter of the closed loop remains less than about 2Ω when the loop is compressed across the diameter by at least 20%.
Public/Granted literature
- US20220217877A1 ELECTRICALLY CONDUCTIVE MULTILAYER FILM AND GASKET Public/Granted day:2022-07-07
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