Invention Grant
- Patent Title: Solder removal from semiconductor devices
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Application No.: US17307253Application Date: 2021-05-04
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Publication No.: US11745281B2Publication Date: 2023-09-05
- Inventor: Mark E. Tuttle
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- The original application number of the division: US15686008 2017.08.24
- Main IPC: B23K1/00
- IPC: B23K1/00 ; B23K1/018 ; H01L23/00 ; H01L21/66 ; B23K3/02 ; B23K3/03 ; B23K3/08 ; B23K101/40 ; B23K101/42
Abstract:
A solder removal apparatus is provided. The solder removal apparatus comprises a plurality of solder-interfacing protrusions extending from a body by a length. Each of the plurality of solder-interfacing protrusions is configured to remove a corresponding one of a plurality of solder features from a semiconductor device, where each of the plurality of solder features has a height and an amount of solder material.
Public/Granted literature
- US20210252621A1 SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES Public/Granted day:2021-08-19
Information query
IPC分类:
