发明授权
- 专利标题： Method of manufacturing head gimbal assembly, head gimbal assembly and hard disk drive
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申请号： US17743443申请日： 2022-05-12
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公开(公告)号： US11749302B1公开(公告)日： 2023-09-05
- 发明人: Ka Yip Wong , Chi Hung Yuen , Ryo Hosoi , Seiichi Takayama
- 申请人： SAE Magnetics (H.K.) Ltd.
- 申请人地址： HK Hong Kong
- 专利权人： SAE Magnetics (H.K.) Ltd.
- 当前专利权人： SAE Magnetics (H.K.) Ltd.
- 当前专利权人地址： HK Hong Kong
- 主分类号： G11B5/48
- IPC分类号： G11B5/48 ; G11B5/00
摘要：
A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which only one solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected with a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size larger than a wiring gap and being in unmelted-solid condition. The head connecting step includes a heat step which an electrode surface of the laser diode is heated.
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