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1.
公开(公告)号:US10650856B1
公开(公告)日:2020-05-12
申请号:US16367224
申请日:2019-03-27
发明人: Ryo Hosoi , Seiichi Takayama
摘要: A thermally assisted magnetic head including a slider and a light source-unit. The slider includes a slider substrate and a magnetic head part. The light source-unit includes a laser diode and a sub-mount. The magnetic head part includes a medium-opposing surface, a light source-opposing surface and a waveguide which guides laser light from the light source-opposing surface to the medium-opposing surface. The thermally assisted magnetic head includes an optimal-structure which the following optimizing conditional expression, concerning an inlet-optical path length L1 of an inlet-interval of the waveguide, and an outlet-optical path length L2 of an outlet-interval, is satisfied, m1×L1=L2 (m1 is a natural number).
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公开(公告)号:US11626133B1
公开(公告)日:2023-04-11
申请号:US17709402
申请日:2022-03-30
发明人: Ka Yip Wong , Chi Hung Yuen , Ryo Hosoi , Seiichi Takayama
摘要: A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which a solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected to a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size smaller than a wiring gap between an electrode surface of the laser diode and the flexure, and being in melted-particle condition.
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3.
公开(公告)号:US10510371B1
公开(公告)日:2019-12-17
申请号:US16282383
申请日:2019-02-22
发明人: Ryo Hosoi , Takashi Honda , Seiichi Takayama
IPC分类号: G11B11/105 , G11B13/08 , G11B5/00 , G11B5/31 , G11B5/60
摘要: A light source-unit comprises a laser diode, a sub-mount which the laser diode is joined, and a heater which is joined on a joint surface of the sub-mount. The sub-mount comprises a pair of barrier-members. The barrier-members are formed with lower thermal conductivity material which thermal conductivity is lower than joining metal which is used for joining the laser diode and the sub-mount. The barrier-members are formed on the joint surface so as to sandwich the heater.
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公开(公告)号:US11887638B1
公开(公告)日:2024-01-30
申请号:US17980771
申请日:2022-11-04
发明人: Ryo Hosoi , Seiichi Takayama , Kang Gao , Yasuhiro Konakawa , Yasutoshi Fujita , Ryuji Fujii
CPC分类号: G11B7/127 , G11B2005/0021
摘要: The laser diode includes an electrode pad layer, being connected to an electrode, and an outer surface in which the electrode pad layer is formed. The electrode pad layer includes a solder-bonding pad part and a solder-contact preventing part. The solder-contact preventing part is formed with small wettability material having solder wettability which is smaller than solder wettability of the solder-bonding pad part. The solder-bonding pad part and the solder-contact preventing part are formed so that a pad height, being a height from the outer surface to a surface of the solder-bonding pad part, is larger than a preventing height, being a height from the outer surface to a surface of the solder-contact preventing part.
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5.
公开(公告)号:US11127424B1
公开(公告)日:2021-09-21
申请号:US16950885
申请日:2020-11-17
发明人: Kang Gao , Seiichi Takayama , Ryo Hosoi , Ryuji Fujii
摘要: A light source-unit includes a laser diode, a sub-mount which the laser diode is joined. The laser diode includes an optical generating layer including an active layer which emits laser-light and cladding layers being formed so as to sandwich the active layer. The active layer includes a quantum dot layer including a plurality of quantum dots, which respectively confine movements of carriers in the three-dimensional directions.
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公开(公告)号:US10311903B2
公开(公告)日:2019-06-04
申请号:US15649961
申请日:2017-07-14
发明人: Seiichi Takayama , Takashi Honda , Ryuji Fujii , Ryo Hosoi , Kaichiu Cheung , Tsutomu Sasaki , Jingtao Lu , Fanglong Nie
摘要: A method of testing dynamic performances for a slider body of a thermally-assisted magnetic head includes: providing a slider body which is disconnected with a light source unit; removably mounting the slider body to a test head suspension assembly; keeping to provide a flat top beam to the slider body, the flat top beam being aligned with the optical waveguide, and a projection of an incident end of the optical waveguide being located within a light spot of the flat top beam; and testing the dynamic performance of the slider body. It can save the material cost and labor cost, and eliminate a precise optical alignment between an input light and an optical waveguide in the slider body to improve testing efficiency.
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公开(公告)号:US11817678B2
公开(公告)日:2023-11-14
申请号:US17211818
申请日:2021-03-25
发明人: Seiichi Takayama , Kang Gao , Ryo Hosoi , Ryuji Fujii
IPC分类号: H01S5/34 , G01S17/931 , H01L33/06 , H01S5/042
CPC分类号: H01S5/3412 , G01S17/931 , H01L33/06 , H01S5/04254
摘要: A semiconductor laser includes an active layer which emits laser light and cladding layers being formed so as to sandwich the active layer. The active layer includes a quantum dot layer including a plurality of quantum dots, which respectively confine movements of carriers in the three-dimensional directions. The laser radar device includes a light projection part which projects laser light and a light receiving part which receives reflected light of the laser light. The light projection part includes the semiconductor laser and a scanner which reflects the laser light, emitted from the semiconductor laser, to form a scanning laser light.
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公开(公告)号:US11763842B1
公开(公告)日:2023-09-19
申请号:US17743435
申请日:2022-05-12
发明人: Ka Yip Wong , Chi Hung Yuen , Ryo Hosoi , Seiichi Takayama
CPC分类号: G11B5/4826 , G11B2005/0021
摘要: A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which only one solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected to a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size larger than a wiring gap between an electrode surface of the laser diode and the flexure, and being in unmelted-solid condition.
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公开(公告)号:US11749302B1
公开(公告)日:2023-09-05
申请号:US17743443
申请日:2022-05-12
发明人: Ka Yip Wong , Chi Hung Yuen , Ryo Hosoi , Seiichi Takayama
CPC分类号: G11B5/4826 , G11B5/484 , G11B2005/0021
摘要: A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which only one solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected with a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size larger than a wiring gap and being in unmelted-solid condition. The head connecting step includes a heat step which an electrode surface of the laser diode is heated.
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公开(公告)号:US20220311217A1
公开(公告)日:2022-09-29
申请号:US17211818
申请日:2021-03-25
发明人: Seiichi Takayama , Kang Gao , Ryo Hosoi , Ryuji Fujii
IPC分类号: H01S5/34 , H01S5/042 , H01L33/06 , G01S17/931
摘要: A semiconductor laser includes an active layer which emits laser light and cladding layers being formed so as to sandwich the active layer. The active layer includes a quantum dot layer including a plurality of quantum dots, which respectively confine movements of carriers in the three-dimensional directions. The laser radar device includes a light projection part which projects laser light and a light receiving part which receives reflected light of the laser light. The light projection part includes the semiconductor laser and a scanner which reflects the laser light, emitted from the semiconductor laser, to form a scanning laser light.
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