Thermally-assisted magnetic recording head having optimal reflecting position inside waveguide

    公开(公告)号:US10650856B1

    公开(公告)日:2020-05-12

    申请号:US16367224

    申请日:2019-03-27

    摘要: A thermally assisted magnetic head including a slider and a light source-unit. The slider includes a slider substrate and a magnetic head part. The light source-unit includes a laser diode and a sub-mount. The magnetic head part includes a medium-opposing surface, a light source-opposing surface and a waveguide which guides laser light from the light source-opposing surface to the medium-opposing surface. The thermally assisted magnetic head includes an optimal-structure which the following optimizing conditional expression, concerning an inlet-optical path length L1 of an inlet-interval of the waveguide, and an outlet-optical path length L2 of an outlet-interval, is satisfied, m1×L1=L2 (m1 is a natural number).

    Method of manufacturing head gimbal assembly, head gimbal assembly and hard disk drive

    公开(公告)号:US11626133B1

    公开(公告)日:2023-04-11

    申请号:US17709402

    申请日:2022-03-30

    IPC分类号: G11B5/48 G11B5/00

    摘要: A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which a solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected to a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size smaller than a wiring gap between an electrode surface of the laser diode and the flexure, and being in melted-particle condition.

    Method of manufacturing head gimbal assembly, head gimbal assembly and hard disk drive

    公开(公告)号:US11763842B1

    公开(公告)日:2023-09-19

    申请号:US17743435

    申请日:2022-05-12

    IPC分类号: G11B5/48 G11B5/00

    CPC分类号: G11B5/4826 G11B2005/0021

    摘要: A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which only one solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected to a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size larger than a wiring gap between an electrode surface of the laser diode and the flexure, and being in unmelted-solid condition.

    Method of manufacturing head gimbal assembly, head gimbal assembly and hard disk drive

    公开(公告)号:US11749302B1

    公开(公告)日:2023-09-05

    申请号:US17743443

    申请日:2022-05-12

    IPC分类号: G11B5/48 G11B5/00

    摘要: A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which only one solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected with a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size larger than a wiring gap and being in unmelted-solid condition. The head connecting step includes a heat step which an electrode surface of the laser diode is heated.

    Semiconductor Laser and Laser Radar Device Having the Semiconductor Laser

    公开(公告)号:US20220311217A1

    公开(公告)日:2022-09-29

    申请号:US17211818

    申请日:2021-03-25

    摘要: A semiconductor laser includes an active layer which emits laser light and cladding layers being formed so as to sandwich the active layer. The active layer includes a quantum dot layer including a plurality of quantum dots, which respectively confine movements of carriers in the three-dimensional directions. The laser radar device includes a light projection part which projects laser light and a light receiving part which receives reflected light of the laser light. The light projection part includes the semiconductor laser and a scanner which reflects the laser light, emitted from the semiconductor laser, to form a scanning laser light.