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公开(公告)号：US11626133B1
公开(公告)日：2023-04-11
申请号：US17709402
申请日：2022-03-30
发明人： Ka Yip Wong , Chi Hung Yuen , Ryo Hosoi , Seiichi Takayama
摘要： A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which a solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected to a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size smaller than a wiring gap between an electrode surface of the laser diode and the flexure, and being in melted-particle condition.
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公开(公告)号：US12027179B1
公开(公告)日：2024-07-02
申请号：US18324695
申请日：2023-05-26
发明人： Seiichi Takayama , Ryuji Fujii , Yasutoshi Fujita , Ka Yip Wong , Chi Hung Yuen
IPC分类号： G11B11/105 , G11B5/48 , G11B13/08 , G11B5/00
CPC分类号： G11B13/08 , G11B2005/0021
摘要： A thermally assisted magnetic head includes a slider having a slider substrate and a magnetic head part, and a light source unit having a laser diode and a sub-mount. The magnetic head part includes a medium-opposite surface, a light source-opposite surface, and a slider-front end surface. The sub-mount includes a joined-end surface and a mount-front end surface, the laser diode includes an electrode surface and an LD-front end surface. The light source unit includes a shift joined structure which the laser diode is joined to a shift area of the joined-end surface, and the light source unit is mounted on the slider substrate so that the electrode surface intersects with a laminated surface of the magnetic head part. The shift area is set in a position which is shifted so that the LD-front end surface is away from the slider-front end surface than the mount-front end surface.
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公开(公告)号：US11763842B1
公开(公告)日：2023-09-19
申请号：US17743435
申请日：2022-05-12
发明人： Ka Yip Wong , Chi Hung Yuen , Ryo Hosoi , Seiichi Takayama
CPC分类号： G11B5/4826 , G11B2005/0021
摘要： A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which only one solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected to a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size larger than a wiring gap between an electrode surface of the laser diode and the flexure, and being in unmelted-solid condition.
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公开(公告)号：US11749302B1
公开(公告)日：2023-09-05
申请号：US17743443
申请日：2022-05-12
发明人： Ka Yip Wong , Chi Hung Yuen , Ryo Hosoi , Seiichi Takayama
CPC分类号： G11B5/4826 , G11B5/484 , G11B2005/0021
摘要： A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which only one solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected with a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size larger than a wiring gap and being in unmelted-solid condition. The head connecting step includes a heat step which an electrode surface of the laser diode is heated.
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