- 专利标题： Maskless etching of electronic substrates via precision dispense process
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申请号： US17003667申请日： 2020-08-26
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公开(公告)号： US11749539B1公开(公告)日： 2023-09-05
- 发明人: Richard Korneisel , Nathaniel P. Wyckoff , Brandon C. Hamilton , Kyle B. Snyder , Jenny Calubayan
- 申请人： Rockwell Collins, Inc.
- 申请人地址： US IA Cedar Rapids
- 专利权人： Rockwell Collins, Inc.
- 当前专利权人： Rockwell Collins, Inc.
- 当前专利权人地址： US IA Cedar Rapids
- 代理机构： Suiter Swantz pc llo
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; H01L21/306 ; H01L21/48
摘要：
Systems and methods for selectively etching features in an electronic substrate via a precision dispense apparatus and precision etchant dispense tool are disclosed. The method includes creating a toolpath instruction for etching at least one feature in the substrate, programming the precision dispense apparatus to execute the created toolpath instruction, and causing the precision dispense tool to deposit etchant material onto the surface of the substrate to etch the substrate surface to produce the at least one feature according to the created toolpath instruction. The capabilities of the systems and methods disclosed herein extend to 3D substrates and post-build processing, among others.
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