Invention Grant
- Patent Title: Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board
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Application No.: US17703051Application Date: 2022-03-24
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Publication No.: US11751322B2Publication Date: 2023-09-05
- Inventor: Joel Goergen , Scott Hinaga , Jessica Kiefer , Alpesh Umakant Bhobe , D. Brice Achkir , David Nozadze , Amendra Koul , Mehmet Onder Cap , Madeline Marie Roemer
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: CISCO TECHNOLOGY, INC.
- Current Assignee: CISCO TECHNOLOGY, INC.
- Current Assignee Address: US CA San Jose
- Agency: Edell, Shapiro & Finnan, LLC
- Main IPC: H05K1/02
- IPC: H05K1/02
Abstract:
A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps.
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