- Patent Title: Microelectronic package electrostatic discharge (ESD) protection
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Application No.: US17468510Application Date: 2021-09-07
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Publication No.: US11751367B2Publication Date: 2023-09-05
- Inventor: Veronica Aleman Strong , Johanna M. Swan , Aleksandar Aleksov , Adel A. Elsherbini , Feras Eid
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Akona IP
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H01L23/60 ; H01L21/48 ; C08G61/12 ; C08G73/06 ; C08G85/00 ; H01L23/498

Abstract:
Embodiments may relate to a microelectronic package comprising: a die and a package substrate coupled to the die with a first interconnect on a first face. The package substrate comprises: a second interconnect and a third interconnect on a second face opposite to the first face; a conductive signal path between the first interconnect and the second interconnect; a conductive ground path between the second interconnect and the third interconnect; and an electrostatic discharge (ESD) protection material coupled to the conductive ground path. The ESD protection material comprises a first electrically-conductive carbon allotrope having a first functional group, a second electrically-conductive carbon allotrope having a second functional group, and an electrically-conductive polymer chemically bonded to the first functional group and the second functional group permitting an electrical signal to pass between the first and second electrically-conductive carbon allotropes.
Public/Granted literature
- US20210410343A1 MICROELECTRONIC PACKAGE ELECTROSTATIC DISCHARGE (ESD) PROTECTION Public/Granted day:2021-12-30
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