Invention Grant
- Patent Title: Semiconductor device and method of forming the same
-
Application No.: US16933914Application Date: 2020-07-20
-
Publication No.: US11751487B2Publication Date: 2023-09-05
- Inventor: Georgios Vellianitis , Gerben Doornbos , Marcus Johannes Henricus Van Dal , Mauricio Manfrini
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H10N52/80
- IPC: H10N52/80 ; H10B61/00 ; H10N50/85 ; H10N52/01 ; H10N52/00

Abstract:
A semiconductor device includes a storage element layer and a selector. The selector is electrically coupled to the storage element layer, and includes a first insulating layer, a second insulating layer, a third insulating layer, a first conductive layer and a second conductive layer. The first insulating layer, the second insulating layer and the third insulating layer are stacked up in sequence, wherein the second insulating layer is sandwiched in between the first insulating layer and the third insulating layer, and the first insulating layer and the third insulating layer include materials with higher band gap as compared with a material of the second insulating layer. The first conductive layer is connected to the first insulting layer, and the second conductive layer is connected to the third insulating layer.
Public/Granted literature
- US20220020919A1 SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME Public/Granted day:2022-01-20
Information query