Invention Grant
- Patent Title: Bumper spoiler structure
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Application No.: US17676419Application Date: 2022-02-21
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Publication No.: US11753088B2Publication Date: 2023-09-12
- Inventor: Yuki Nakamura , Kei Ambo , Kenichi Ando
- Applicant: HONDA MOTOR CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: HONDA MOTOR CO., LTD.
- Current Assignee: HONDA MOTOR CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Rankin, Hill & Clark LLP
- Priority: JP 21041825 2021.03.15
- Main IPC: B62D35/00
- IPC: B62D35/00 ; B60R19/48 ; B60R19/02

Abstract:
A bumper spoiler structure includes: a bumper panel provided in a bumper of a vehicle; a bumper spoiler capable of advancing and retreating relative to the bumper panel by being moved in an inside-outside direction of the vehicle; a first actuator movable in the inside-outside direction and configured to move the bumper spoiler in the inside-outside direction; a first controller configured to control the first actuator; a second actuator configured to move the bumper spoiler and the first actuator in the inside-outside direction; and a second controller configured to control the second actuator. When at least one of the first actuator and the first controller is lost in a deployed state in which the bumper spoiler protrudes with respect to the bumper panel, the second controller moves the bumper spoiler and the first actuator toward an inner side of the vehicle by using the second actuator.
Public/Granted literature
- US20220289314A1 BUMPER SPOILER STRUCTURE Public/Granted day:2022-09-15
Information query
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