- 专利标题： Heat exchanger module, assembly-type heat exchanger including heat exchanger module, and heat exchanger assembly system
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申请号： US16942303申请日： 2020-07-29
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公开(公告)号： US11754350B2公开(公告)日： 2023-09-12
- 发明人: Wooram Hong , Jeonghun Kim , Hyundo Choi , Hyukju Kwon , Youngjin Park , Aram Jeon , Yongsik Jung , Wonje Choi , Taesin Ha
- 申请人： SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址： KR Suwon-si
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Suwon-si
- 代理机构： Sughrue Mion, PLLC
- 优先权： KR 20190168144 2019.12.16
- 主分类号： F28F9/26
- IPC分类号： F28F9/26 ; F28F7/02 ; B25J9/16 ; B25J15/00
摘要：
A heat exchanger module includes a first heat exchanging body including at least one first through hole and a second heat exchanging body including at least one second through hole. The second heat exchanging body is configured to be coupled to the first heat exchanging body, and an accommodation hole is provided between the first heat exchanging body and the second heat exchanging body by the first heat exchanging body and the second heat exchanging body being coupled together.
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