专利检索 ap:("SAMSUNG ELECTRONICS CO., LTD.") AND inv:"Wonje Choi" 第 1 页

1.

发明授权
Heat exchanger module, assembly-type heat exchanger including heat exchanger module, and heat exchanger assembly system 有权

公开(公告)号：US11754350B2

公开(公告)日：2023-09-12

申请号：US16942303

申请日：2020-07-29

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Wooram Hong , Jeonghun Kim , Hyundo Choi , Hyukju Kwon , Youngjin Park , Aram Jeon , Yongsik Jung , Wonje Choi , Taesin Ha

IPC分类号： F28F9/26 , F28F7/02 , B25J9/16 , B25J15/00

CPC分类号： F28F9/26 , B25J9/1687 , F28F7/02 , B25J15/00 , F28F2275/14

摘要： A heat exchanger module includes a first heat exchanging body including at least one first through hole and a second heat exchanging body including at least one second through hole. The second heat exchanging body is configured to be coupled to the first heat exchanging body, and an accommodation hole is provided between the first heat exchanging body and the second heat exchanging body by the first heat exchanging body and the second heat exchanging body being coupled together.