Invention Grant
- Patent Title: High-performance, high-capacity memory systems and modules
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Application No.: US17507588Application Date: 2021-10-21
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Publication No.: US11755508B2Publication Date: 2023-09-12
- Inventor: Frederick A. Ware , Ely Tsern , John Eric Linstadt , Thomas J. Giovannini , Craig E. Hampel , Scott C. Best , John Yan
- Applicant: Rambus Inc.
- Applicant Address: US CA San Jose
- Assignee: Rambus Inc.
- Current Assignee: Rambus Inc.
- Current Assignee Address: US CA San Jose
- Agency: Silicon Edge Law Group LLP
- Agent Arthur J. Behiel
- The original application number of the division: US15525379
- Main IPC: G06F13/16
- IPC: G06F13/16
Abstract:
Described are motherboards with memory-module sockets that accept legacy memory modules for backward compatibility or accept a greater number of configurable modules in support of increased memory capacity. The configurable modules can be backward compatible with legacy motherboards. Equipped with the configurable modules, the motherboards support memory systems with high signaling rates and capacities.
Information query
