Invention Grant
- Patent Title: Sensing component with a common node
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Application No.: US17646261Application Date: 2021-12-28
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Publication No.: US11756602B2Publication Date: 2023-09-12
- Inventor: Umberto Di Vincenzo , Michele Maria Venturini
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Holland & Hart LLP
- Main IPC: G11C11/22
- IPC: G11C11/22 ; G11C16/28 ; G11C16/04

Abstract:
Methods, systems, and devices for sensing component with a common node are described. A set of sense circuits of a memory device may include a shared differential amplifier having a first branch for each sense circuit and a shared second branch, as well as a shared common node. A respective latch of each sense amplifier may be initialized to a second logic state, and the common node may undergo a voltage ramp to determine the state stored in the memory cell. If the memory cell stores the first logic state, the sense amplifier may couple with the common node to draw the current and switch the state of the latch to the first logic state. Alternatively, if the memory cell stores the second logic state the current may not be drawn and the state of the latch may not switch.
Public/Granted literature
- US20230206979A1 SENSING COMPONENT WITH A COMMON NODE Public/Granted day:2023-06-29
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