- 专利标题： Power feeding mechanism and method for controlling temperature of a stage
-
申请号： US17444850申请日： 2021-08-11
-
公开(公告)号： US11756807B2公开(公告)日： 2023-09-12
- 发明人: Dai Kitagawa
- 申请人： Tokyo Electron Limited
- 申请人地址： JP Tokyo
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JP Tokyo
- 代理机构： IPUSA, PLLC
- 优先权： JP 14098569 2014.05.12
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; H01L21/683 ; H05B1/02 ; H01J37/32
摘要：
A heater power feeding mechanism is provided that divides a stage on which a substrate is placed into zones by using a plurality of heaters and can control a temperature of each of the zones. The heater power feeding mechanism includes a plurality of sets of heater terminals connected to any of the plurality of heaters by a segment unit when a set of the heater terminals is made one segment, a heater interconnection, and an interconnection structure configured to connect at least any of the plurality sets of the heater terminals with each other by using the heater interconnection by the segment unit.
公开/授权文献
信息查询
IPC分类:
